Packaging Engineer
Location
Richardson, TX
Level
Entry-Level
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2026-01-02
Responsibilities
- Provide industry expertise to maintain Qorvo's leadership in packaging solutions.
- Utilize program management to plan and monitor product development projects.
- Lead cross-functional teams through New Product Introduction (NPI) processes.
- Design for manufacturability and cost to ensure smooth transitions to high volume manufacturing.
- Develop advanced design rules for next generation products.
- Collaborate with technology and business units to implement new packaging solutions.
- Apply structured problem-solving methodologies in project execution.
Job Requirements
- BS degree or higher in Engineering or Material Science.
- Knowledge and experience in semiconductor packaging technologies.
- Background in process/packaging technologies related to RF Modules or high power packages.
- Familiarity with assembly and packaging processes and materials.
- Understanding of Design for Manufacturability in a high volume environment.
- Ability to utilize SPC techniques and structured problem-solving methodologies.
- Experience with Program Management Methodology.
