Principal PCB Engineer – Datacenter / High-Speed Systems
Job Description
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly experienced
PCB Engineer
to drive next-generation
Datacenter and High-performance computing (HPC) platforms
.
This role will focus on
advanced PCB technologies, manufacturability optimization, and supplier engagement
, supporting both
NPI and volume production
while shaping Qualcomm’s future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness
Hands on experience with PCB process including d
efin
ing
and drivePCB design guidelines / stack-up / routing strategyfor high-speed, high-layer count datacenterPCB
boards
Develop and maintain
DFM (Design for Manufacturability) librariesto ensure design compliance with supplier capability
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation
Engage with
PCB manufacturers (fabricators & assemblers)to:
Understand
design rule capability (trace/space, via structures, stack-up complexity, materials)
Evaluate
BOM capability including advanced laminates, low-loss materials, and new technologies
Collect and analyze supplier data to
validate manufacturing capability vs design requirements
Drive
multi-source strategy and supplier qualificationfor high-volume production
3. NPI & Manufacturing Support
Support
critical NPI buildsfor datacenter platforms (AI/ComputePCB
boards, high-power systems)
Troubleshoot
PCB fabrication / assembly issues:
Yield excursions
Reliability failures
Process limitations
Lead root cause analysis and implement
corrective & preventive actions (CAPA)
4. Technology Roadmap Development
Drive
PCB technology roadmapin collaboration with suppliers:
Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)
New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)
High layer count / ultra-high density interconnect solutions
Pioneer and implement
new structures, technologies, and BOM solutionsto advance Qualcomm’s platform capability
5. Industry & Competitive Intelligence
Monitor
industry trends (Datacenter, AI infrastructure, high-speed PCB technology)
Perform
competitive benchmarking (Hyperscalers, ODM ecosystem, etc.)
Identify emerging strategies to ensure Qualcomm remains aligned with
leading-edge technology directions
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
15+ years of PCB / substrate engineering experience
(Datacenter / server / high-speed system preferred)
Strong understanding of:
High-speed design fundamentals (SI/PI, loss, impedance control)
Advanced PCB fabrication processes (MLB,
HDI, mSAP, build-up, lamination cycles)
PCB materials (low-loss laminates
/Core & PPG, Cu foil
,
Plating chemistry, SR, Surface Finish, etc.)
Experience working directly with
PCB suppliers (fab + assembly/CM)
Proven track record in
NPI builds and manufacturing issue resolution
Experience with
AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
Familiarity with
advanced packaging interaction (SiP, substrate, bridge-based systems)
Experience driving
technology co-development with suppliers
Ability to influence cross-functional and executive stakeholders
Key Competencies
Strong analytical and problem-solving skills
Data-driven decision making
Ability to communicate clearly with
suppliers, internal teams, and executive leadership
Experience managing ambiguity in fast-paced NPI environments
Impact
In this role, you will directly influence:
Qualcomm’s
datacenter and AI hardware competitiveness
Supplier ecosystem maturity and scalability
Adoption of
next-generation PCB technologies and materials
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail
disability-accomodations@qualcomm.com
or call Qualcomm's toll-free number found
. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies:
Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited
resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range
and Other Compensation & Benefits
:
$201,600.00 - $302,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this
.
If you would like more information about this role, please contact
.