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Advanced Packaging Process Integration Engineer

Job Description

Posted on: 

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

www.gf.com

.

Summary of Role:

This a

dvanced

packaging process integration engineer

ing role will lead

post

Fab process development to meet customer re

quirements.  

T

he candidate will have a strong focus on

wafer finishing and assembly

processes to

support silicon photonics

and other

product line

s

Essential Responsibilities:

  • Lead

    packaging

    process development efforts and planning by working with the unit process engineers

    and

    directly with tools & materials

    suppliers

    for

    a

    dvanced

    p

    ackaging

    in

    Burlington

    ,

    VT

    (Fab

    9

    )

  • Drive

    semiconductor processdevelopment in

    CMP, wafer thinning, and dicing

    .

    Collaborate with

    unit process engineers

    to develop

    new processes

    for

    advanced packaging roadmaps

    .

  • Lead next generation packaging and assembly

    development to support different product needs

    .

    Partner with internal design,

    fabrication

    and packaging teams to

    set assembly

    specs/requirements

    and

    drive new a

    ssembly

    flow/

    process

    development

    .

  • Dri

    ve

    under

    standing

    of

    failure

    modes

    and

    work

    with

    cross

    functional teams to

    identify

    and

    resolve technical

    issue

    s.

  • Adopt design for cost

    methodology

    to enable continuous improvement projects. 
  • Generate IP related to novel wafer integration & packaging technology. 

  • Drive end-to-end process integration and planning to enable new capability planning, early product

    prototyping

    and qualification across multiple programs.
  • Develop

    expertise

    in processes,

    materials

    and

    tooling to

    leverage

    available characterization resources.
  • Collaborate with OSATs (Outsourced Assembly and Test) to develop new

    packaging

    integration processes.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security

    requirements

    and programs.
  • Other duties as assigned by

    the manager

    .

Required Qualifications:

  • Education –

    PhD

    in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials

    Sc

    ie

    nce

    o

    r

    related

    fields

    from an accredited degree program.
  • A

    t least 1

    5

    years of prior related work experiencein

    wafer finishing (

    thinning, dicing,

    bumping, and

    RDL

    )

    and assembly processes.
  • Language Fluency - English (Written & Verbal)

    .

  • Travel - Up to 10%.

Preferred Qualifications:

  • Experience in bringing packaged products from development into production.

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 

  • Project management skills,

    i.e.

    the ability to innovate and

    execute

    solutions that matter; the ability to navigate ambiguity

    .  

  • Strong written and verbal communication skills

    .

  • Strong planning

    and organizational

    skills

    .

Expected Salary Range

$143,000.00 - $247,000.00

The exact Salary will be determined based on qualifications, experience and location.

The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at

usaccommodations@gf.com

and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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