Advanced Packaging Cryogenic Modeling Engineer

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries

makes

possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

www.gf.com

.

Summary of Role:

GlobalFoundries is

seeking

an experienced

thermal,

mechanical, and/or electrical modeler/engineer with

demonstrated

cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi

-

physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.

Essential Responsibilities:

• Demonstrated experience using commercial software to develop and correlate cryogenic

  thermal,

  mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.

• Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling. 

• Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling. 

• Facilitate discussion with

  originating

  team to

  identify

  simulations that highlight critical process interactions and drive

  optimal

  3DHI technology decisions.

• Apply commercial simulation software to mimic

  cryogenic

  semiconductor process flows and highlight the areas of concern.

• Extensive interaction with integration, device, and design engineers to

  assure

  development of

  a working

  technology

  .

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security

  requirements

  and programs. 

• Other duties as assigned by

  manager

  .

Required Qualifications:

• M.S. + minimum of

  10

  years of relevant experience

  .

• Semiconductor mechanical

  ,

  thermal

  and/

  or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications

  .

• Strong problem solving and technical trouble shooting skills including 

  expertise

   in design of experiment

  .

• Must have at least an overall 3.0 GPA and proven good academic standing

  .

• Language Fluency - English (Written & Verbal)

  .

• Solid understanding of semiconductor processes and integration techniques

  .

• Good computer / software skills

  .

• Ability to clearly present results to small and large groups

  .

• Travel - Up to 10%

  .

Preferred Qualifications: 

• PhD +

  8

  years of relevant experience

  .

• Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…)

  .

• Demonstrated work performance in an environment requiring

  a high

  levelof attention to detail and timeliness

  .

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 

• Project management skills,

  i.e.

  the ability to innovate and

  execute

  solutions that matter; the ability to navigate ambiguity

  .

• Strong written and verbal communication skills

  .

• Strong planning

  & organizational

  skills

  .

Expected Salary Range

$118,000.00 - $239,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at

usaccommodations@gf.com

and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law