Advanced Packaging Integration Engineer
Job Description
Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Salary:
$138,000.00 - $190,000.00
Location:
Santa Clara,CA
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our
.
Join
the Photonics Platform Business Group at Applied Materials
located in Santa Clara
headquarters,
work with a high
caliber
cross-functional
research
team to develop advanced
packaging soluti
ons
for
next-generation smart glasses
and
high
‑
performance optical interconnects
.
As an
Advanced Packaging Integration Engineer
, you will lead process integration for high
‑
performance interconnects and micro
-
LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, suppliers, and cross
‑
functional teams across Applied Materials and external partners. You will work closely with design, process,
integration
, and metrology teams to deliver production
‑
ready solutions.
Key Responsibilities:
Define, develop,
execute,
and optimize advanced packaging process
integrationflows (e.g.,h
ybrid bonding
,
2.5D/
3D heterogeneous integration
)
, to
ensur
e
the highestpossible
product performance, yield, and reliability.
Own, manage, and drive
complex
technical project
s
,
track progress and solve roadblocks to ensure on time delivery with high quality.
Design experiments, systematically collect and a
nalyze
data,
drive
root-cause
analysis
and implement corrective actions.
Collaborate with
foundries,
OSATs
,
and
internal research teamsto defineand
implement
improved
integration strategies and methodologies.
Stay
abreast of
the latestfield
advancements
. A
pply
such
knowledge to drive
innovations.
Qualifications
Ph.D.
or M. S.
degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or
a
related
STEMfield.
In
‑
depth knowledge and hands
‑
on experience in advanced packaging technologies, including wafer
‑
to
‑
wafer or die
‑
to
‑
wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply.
Micro-LED or CPO experience
is a plus.
Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP).
Coding capability is a plus.
E
xperience
with
MES system
s
is a plus.
Ability to prepare clear, compelling executive
‑
level or customer
‑
facing presentations is a plus.
Self
‑
starter with strong problem
‑
solving skills; able to work both independently and in team environments with minimal supervision.
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our
accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at
Accommodations_Program@amat.com,
or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
