Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2026
Location
Boxborough, MA
Level
Internship
Department
Semiconductors
Type
Salary
$32,000 - $36,000
Job Description
Posted on:
2025-09-03
Responsibilities
- Work on system architecture, modeling, power, and thermal management.
- Engage in front-end design, including micro-architecture and RTL.
- Participate in physical design tasks such as place & route and timing closure.
- Contribute to pre-silicon verification and post-silicon validation.
- Support GPU and CPU engineering efforts, including validation and optimization.
- Assist in digital design and DV tasks, focusing on modem and DSP technologies.
- Collaborate with teams on SoC systems engineering and performance modeling.
Job Requirements
- Currently enrolled in a bachelor's, master's, or Ph.D. program in a relevant field.
- Availability for 11-14 weeks during Summer 2026.
- Academic experience with programming languages (C, C++, Python, etc.).
- Interest in multiple technical tracks (GPU, CPU, Digital Design, SoC).
- Familiarity with digital design concepts and tools.
- Understanding of power/performance tradeoffs in systems.
- Strong problem-solving skills and ability to work in a team environment.
