Qualcomm

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-11-30

Responsibilities

  • Collaborate on system architecture, modeling, power, and thermal profiling.
  • Participate in front-end design including micro-architecture and RTL.
  • Engage in physical design tasks such as place & route and timing closure.
  • Assist in pre-silicon verification and post-silicon validation.
  • Work with programming languages relevant to hardware design and verification.
  • Support the development of test and coverage plans for CPU and SoC validation.
  • Contribute to the execution of verification plans and debugging processes.

Job Requirements

  • Currently enrolled in a relevant degree program (Bachelor's, Master's, or Ph.D.).
  • Must be available for 11–14 weeks during Summer 2026.
  • Expected graduation date of November 2026 or later.
  • 1+ years of academic experience with programming languages (C, C++, Python, etc.).
  • Familiarity with digital design, DSP, and wireless communication technologies.
  • Interest in multiple technical tracks (GPU, CPU, Digital Design, SoC).
  • Strong problem-solving skills and ability to work in a team environment.
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