Package Engineering Intern - Ph. D Degree
Location
Santa Clara, CA
Level
Internship
Department
Semiconductors
Type
Salary
$52,000 - $104,000
Job Description
Posted on:
2026-02-25
Responsibilities
- Learn and engage in product-based package projects.
- Participate in package substrate design and layout reviews.
- Understand the FCBGA assembly and substrate fabrication processes.
- Develop new packages and DFX to improve yield.
- Address manufacturing, quality, and reliability issues.
- Collaborate with the engineering team on various projects.
- Apply engineering knowledge to real-world applications.
Job Requirements
- Currently pursuing a Ph.D. or MS in Mechanical, Material, or Chemical Engineering.
- Good verbal and written communication skills.
- Semiconductor package related experience is a plus.
- Basic semiconductor package design skills.
- Familiarity with PCB design concepts.
- Proficiency in AutoCAD and computer skills.
- Willingness to learn and contribute to team projects.
