2026 Undergrad ASIC Package Engineering Intern/Co-Op

The role is for an intern/co-op position in Package Engineering at AMD, focusing on advanced package technology within the Adaptive and Embedded Computing Group. The intern will work with suppliers on package assembly and qualification, generate documentation, and analyze quality metrics.

• Work with package & assembly suppliers for high reliability flip chip product.
• Generate or revise key package documentation.
• Analyze assembly yield and quality metrics.
• Assist in setting up key process indicators for package & assembly quality.
• Collaborate with the engineering team on projects.
• Participate in the development of advanced packaging solutions.
• Gain real-world experience in a dynamic engineering environment.

• Currently enrolled in a Master's degree program in Materials Science, Mechanical Engineering, or a related field.
• Knowledge of material and/or process characterization in IC packaging.
• Skills in creating package documentation and performing engineering data analysis.
• Detail-oriented and able to multitask.
• Familiarity with FA techniques.
• Proficiency in AutoCAD and Python programming.
• Experience with FEA software (such as ANSYS) and thermal simulation tools is a plus.