Systems Engineering Intern (Material Science)

This role is for a Systems Engineering Intern at Texas Instruments, focusing on developing techniques for magnetics integration and evaluating silicon systems, among other responsibilities.

• Develop techniques for magnetics integration into packaging substrate.
• Create characterization methodology for benchmarking.
• Develop feasibility plans for advanced analog power chips.
• Interface with business units and customers to define product roadmaps.
• Assess and negotiate IC development tradeoffs.
• Gather user requirements and translate them to functional specifications.
• Perform troubleshooting and debugging on system-related issues.

• Currently pursuing a graduate degree in Material Science, Electrical Engineering, or related field.
• Minimum GPA of 3.0/4.0.
• Understanding of material science for semiconductor packaging.
• Knowledge of microelectronic fabrication and electrochemistry.
• Strong analytical and problem-solving skills.
• Effective written and verbal communication skills.
• Ability to work in teams and manage time effectively.