Mechanical Packaging Engineer Co-op
Location
New York, NY
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-12-13
Responsibilities
- Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization.
- Support advanced packaging components and test fixtures for new products using 3D software.
- Generate manufacturing drawings.
- Drive package debug activities during product validation and qualification.
- Document fabrication, inspection, and assembly processes.
- Collaborate effectively with engineering staff, external vendors, and contractors.
- Stay current with new technological advancements in packaging design.
Job Requirements
- Current M.S. or Ph.D. student in mechanical engineering, physics, or related fields.
- Experience with 3D CAD design, tolerance analysis, and GD&T using SolidWorks or similar software.
- Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
- Solid interpersonal, communication, and problem-solving skills.
- Knowledge of design for manufacturing of 2.5D/3D packaging is a plus.
- Familiarity with metrology techniques such as SEM/XSEM or confocal microscopy is advantageous.
- Interest in high-speed electronics package design or laser package design is preferred.
