Mechanical Packaging Engineer Co-op
Location
New York, NY
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-09-29
Responsibilities
- Design advanced packaging components and test fixtures using 3D software.
- Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization.
- Plan and drive prototype assembly builds with contract manufacturers.
- Apply knowledge of Design for Manufacturing principles.
- Drive package debug activities during product validation and qualification.
- Document fabrication, inspection, and assembly processes.
- Interact effectively with engineering staff and external vendors.
Job Requirements
- Current M.S. or Ph.D. student in mechanical engineering or related fields.
- Experience with 3D CAD design and tolerance analysis using SolidWorks or similar software.
- Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
- Strong interpersonal, communication, and problem-solving skills.
- Knowledge of design for manufacturing of 2.5D/3D packaging is a plus.
- Familiarity with metrology techniques like SEM/XSEM or equivalent is desirable.
- Experience in high-speed electronics package design is a plus.
