Mechanical Packaging Engineer Co-op
Location
New York, NY
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2026-02-14
Responsibilities
- Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization.
- Support advanced packaging components and test fixtures for new products using 3D software.
- Generate manufacturing drawings.
- Apply knowledge of Design for Manufacturing principles.
- Drive package debug activities during product validation and qualification.
- Document fabrication, inspection, and assembly processes.
- Collaborate with engineering staff, external vendors, and contractors effectively.
Job Requirements
- Current M.S. or Ph.D. student in mechanical engineering, physics, or related field.
- Experience with 3D CAD design and tolerance analysis using SolidWorks or similar software.
- Knowledge of thermal and thermo-mechanical simulations using ANSYS or similar software.
- Solid interpersonal, communication, and problem-solving skills.
- Familiarity with design for manufacturing of 2.5D/3D packaging (preferred).
- Experience in high-speed electronics package design (preferred).
- Knowledge of metrology techniques (preferred).
