Mechanical Packaging Engineer
Location
New York, NY
Level
Mid-Level
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2026-01-06
Responsibilities
- Lead package design and architecture in collaboration with cross-functional teams.
- Innovate designs while applying Design for Manufacturing principles.
- Perform FEA structural analysis and thermal analysis.
- Maintain mechanical drawings and manufacturing documentation.
- Plan and drive prototype assembly builds for early design validation.
- Drive package debug activities during product validation and qualification.
- Survey new materials and vendors for Advanced Packaging activities.
Job Requirements
- Advanced Degree in Mechanical Engineering with 3-5 years of experience in high-volume packaging.
- Expertise in 3D CAD design and Geometric Dimensioning and Tolerancing (GD&T).
- Experience in thermal and thermo-mechanical simulations using ANSYS or similar software.
- Knowledge of package and process design from design to production.
- Experience with documentation of fabrication and assembly processes.
- Strong interpersonal, communication, and problem-solving skills.
- Familiarity with Industry Test Standards such as JEDEC and Mil-Std.
