Lockheed Martin

ElectroMechanical Packaging Engineer III

Job Description

Posted on: 
2026-06-01

Responsibilities

  • Develop and sustain electronics packaging for the Fleet Ballistic Missile Avionics team.
  • Act as a technical lead for Electro-Mechanical items within the Avionics Portfolio.
  • Prepare necessary documentation for production of Avionics hardware.
  • Conduct failure analysis of hardware defects and identify root causes.
  • Participate in Material Review and Failure Review Boards.
  • Interface with various engineering and quality assurance teams regarding material quality.
  • Support missile-level investigations and troubleshooting.

Job Requirements

  • Bachelor's degree in Mechanical or Aerospace Engineering or related discipline.
  • 3+ years of professional experience.
  • Proficiency in CAD modeling (CREO, SolidWorks).
  • Knowledge of Geometric Dimensioning and Tolerancing (GD&T).
  • Ability to obtain and maintain a DoD Secret clearance.
  • Experience with full product life cycle and hardware design integration.
  • Familiarity with missile/aerospace-related processes and specifications.
Apply now

More job openings