Mechanical Analysis Packaging Engineer
Location
Phoenix, AZ
Level
Senior-Level
Department
Semiconductors
Type
Salary
$100,000 - $190,000
Job Description
Posted on:
2025-12-05
Responsibilities
- Develop and validate finite element analysis (FEA) models for thermal and mechanical behavior of semiconductor packages.
- Perform simulations to evaluate stress, strain, warpage, delamination, and reliability risks.
- Collaborate with cross-functional teams to define simulation requirements and interpret results.
- Design and coordinate lab tests to understand material behavior and reliability failure mechanisms.
- Drive strategic development activities and communicate with customer organizations.
- Utilize experimental and numerical methods to solve engineering problems.
- Leverage advanced analysis methods to supplement modeling and experimental approaches.
Job Requirements
- Master's Degree in Mechanical Engineering, Chemical Engineering, or Material Sciences with 3+ years of relevant experience, or a PhD in a related field.
- Experience with multi-physics simulations and coupled analyses.
- Proficiency in designing and executing experiments and interpreting results.
- Knowledge of scripting and automation tools (e.g., Python, TCL, MATLAB).
- Strong understanding of advanced packaging technologies and semiconductor processes.
- Experience with AI and machine learning concepts in programming/script development.
- Previous work experience in a semiconductor foundry is preferred.
