Director, 2.5D/3D Process Development
Location
Santa Clara, CA
Level
VP / Executive
Department
Semiconductors
Type
Salary
$215,000 - $245,000
Job Description
Posted on:
2025-09-16
Responsibilities
- Build, lead, and manage a high-performance team for assembly & packaging process technology.
- Work with cross-functional teams to develop packaging solutions from concept to high volume manufacturing.
- Manage qualification of packages with a focus on reliability and cost.
- Drive innovation of advanced package solutions in collaboration with vendors.
- Identify and mitigate risks associated with new technologies in product integration.
- Ensure factory readiness during the New Product Introduction (NPI) phase.
- Communicate technical and project status effectively at the executive level.
Job Requirements
- 15+ years of experience in Semiconductor Packaging and Process Development.
- Expert understanding of advanced foundry process nodes and packaging technologies.
- Proven track record in bringing products from technology development to high volume manufacturing.
- Familiarity with reliability testing and failure analysis.
- Previous management experience with direct reports and resource allocation.
- M.S or Ph.D. in Mechanical Engineering, Materials Science, or Physics.
- Excellent problem-solving and communication skills.
