Packaging Engineering Internship - 6-12 Months
Location
Mount Prospect, IL
Level
Internship
Department
Semiconductors
Type
Salary
$41,000 - $48,000
Job Description
Posted on:
2025-07-02
Responsibilities
- Designing & testing Amazon Frustration-Free Packaging
- Designing die lines and cutting corrugate prototypes
- Creating supplier bid packages according to project specifications
- Assisting in validating new packaging materials
- Creating packaging instructions
- Redesigning existing packaging for optimization & margin enhancement
- Supporting accurate specifications in the system and inputting packaging documents
Job Requirements
- Currently enrolled in or recent graduate of an accredited program in Packaging Engineering or related field
- Minimum 3.0 GPA required
- Experience with ArtiosCAD or equivalent 2D/3D CAD
- Experience working with CAPE or TOPS
- Experience with Adobe Illustrator (preferred)
- Knowledge of packaging materials, preferably corrugate, paperboard, and plastics
- Knowledge of industry standards (ISTA, ASTM)
