Packaging Engineering Intern - Winter
Location
San Francisco, CA
Level
Internship
Department
Semiconductors
Type
Salary
$105,000 - $126,000
Job Description
Posted on:
2025-10-22
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication.
- Integrate mechanical, electrical, and optical components in system assembly.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Engage in hands-on package/wafer processing (3D printing, metal plating, lithography, metrology).
Job Requirements
- Pursuing a Bachelor’s Degree or higher in engineering.
- At least 1-2 hands-on lab experiences, ideally in metal plating work or fabricating devices.
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection).
- Hands-on prototyping experience and quick design cycle capabilities.
- Nice-to-have: Experience in mechatronics or electromechanical system design.
- Familiarity with lasering and 3D printing.
- Hands-on experience with nano-fabrication tools and metrology tools.
