Packaging Engineering Intern - Summer
Location
San Francisco, CA
Level
Internship
Department
Semiconductors
Type
Salary
$105,000 - $126,000
Job Description
Posted on:
2025-10-03
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication.
- Integrate mechanical, electrical, and optical components in system assembly.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Engage in hands-on package/wafer processing including 3D printing and metal plating.
Job Requirements
- Pursuing a Bachelor’s Degree or higher in engineering.
- 1-2 hands-on lab experiences, ideally in metal plating or device fabrication.
- Strong foundation in mechanical engineering (Solidworks/Onshape).
- Hands-on prototyping experience and ability to move through design cycles quickly.
- Nice-to-have: experience in mechatronics or electromechanical system design.
- Familiarity with lasering and 3D printing.
- Experience with nano-fabrication and metrology tools.
