Packaging Engineering Intern - Summer

The role is for a Packaging Engineering Intern at Atomic Semi, a semiconductor startup focused on developing packaging technologies. Interns will engage in hands-on engineering, working with tools and processes related to semiconductor packaging.

• Design and iterate on machines and subsystems for semiconductor packaging fabrication.
• Integrate mechanical, electrical, and optical components in system assembly.
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Conduct hands-on package/wafer processing, including 3D printing and metal plating.
• Engage in experiment design and data analysis.
• Utilize lab tools independently after training.
• Participate in end-to-end process development and integration work.

• Pursuing a Bachelor’s Degree or higher in engineering.
• 1-2 hands-on lab experiences, ideally in metal plating or fabrication.
• Strong foundation in mechanical engineering (e.g., Solidworks/Onshape).
• Hands-on prototyping experience and quick design cycle capabilities.
• Nice-to-have: experience in mechatronics or electromechanical design.
• Familiarity with lasering, 3D printing, and reliability testing.
• Experience with nano-fabrication tools and metrology tools.