Packaging Engineering Intern - Fall
Location
San Francisco, CA
Level
Internship
Department
Semiconductors
Type
Salary
$105,000 - $126,000
Job Description
Posted on:
2026-03-31
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication.
- Integrate mechanical, electrical, and optical components in system assembly.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Engage in hands-on package/wafer processing including 3D printing and metal plating.
- Conduct experiment design and data analysis.
- Utilize various tools independently for prototyping and testing.
- Maintain a portfolio showcasing previous projects and experiences.
Job Requirements
- Pursuing a Bachelor’s Degree or higher in engineering.
- 1-2 hands-on lab experiences, ideally in metal plating or device fabrication.
- Strong foundation in mechanical engineering, including software like Solidworks or Onshape.
- Hands-on prototyping experience and ability to move through design cycles quickly.
- Familiarity with 3D printing and lasering technologies.
- Experience with reliability testing, soldering, and reflow testing.
- Knowledge of nano-fabrication tools and metrology tools is a plus.
