Packaging Engineer
Location
Austin, TX
Level
Mid-Level
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-09-24
Responsibilities
- Work closely with design, foundry, substrates, and OSAT teams for design for manufacturing (DFM).
- Drive supplier engagement for continuous improvement and new capabilities.
- Plan and manage New Product Introduction (NPI) activities with external partners.
- Resolve issues with external manufacturers and prevent future problems.
- Monitor and improve product yield and quality through collaboration.
- Execute change management processes involving internal and external parties.
- Manage regional supplier performance to meet key performance indices.
Job Requirements
- Bachelor's or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field (PhD preferred).
- Strong knowledge in Flip Chip Packaging and experience in semiconductor manufacturing.
- Good leadership and interpersonal skills.
- Familiarity with tools like JMP and minitab, and industry standards (ESD, Jedec, Automotive).
- Ability to thrive in a fast-paced, multi-tasking environment.
- Excellent project management and conflict management skills.
- Strong communication and executive presentation skills.
