Packaging Engineering Intern - Santa Clara

Texas Instruments is seeking a Packaging Engineering Intern to work on semiconductor packaging technologies for analog and embedded processing products.

• Interface across various work areas and organizations for the design, development, and analysis of semiconductor packaging technologies.
• Participate in cross-functional teams to develop internal and external solutions for advanced packages.
• Work on material, mechanical, thermal, and electrical characterization for packaging advancements.

• Currently pursuing a Master's degree in relevant engineering fields.
• Strong analytical and problem-solving skills.
• Knowledge of semiconductor packaging processes and materials.
• Excellent written and verbal communication skills.
• Ability to work in teams and collaborate effectively.