Packaging Engineering Intern MS/PhD
Location
Dallas, TX
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-09-17
Responsibilities
- Collaborate with various teams on semiconductor packaging technologies.
- Participate in the development of internal and external packaging solutions.
- Work on advancements in material, mechanical, thermal, and electrical characterization.
- Engage in the analysis of Wirebond, Flip Chip, Modules, and other advanced packages.
- Support initiatives aimed at miniaturization, integration, and high reliability of packaging.
- Contribute to problem-solving and analytical tasks related to packaging processes.
- Foster effective communication and collaboration within diverse teams.
Job Requirements
- Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Minimum cumulative GPA of 3.0/4.0.
- Preferred knowledge in semiconductor packaging processes and reliability.
- Strong analytical and problem-solving skills.
- Effective written and verbal communication abilities.
- Capacity to manage time effectively for project delivery.
- Initiative and drive for results in a fast-paced environment.
