Packaging Engineering Intern MS/PhD
Location
Dallas, TX
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-10-08
Responsibilities
- Interface across various work areas and organizations to assist in semiconductor packaging technology development.
- Participate in cross-functional teams to develop solutions for semiconductor packaging.
- Work on different packaging technologies including Wirebond, Flip Chip, and Modules.
- Conduct mechanical, thermal, and electrical characterization of packaging materials.
- Collaborate effectively with team members from different functions.
- Cultivate advancements in semiconductor packaging technologies.
- Ensure timely project delivery through strong time management skills.
Job Requirements
- Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or related fields.
- Minimum cumulative GPA of 3.0/4.0.
- Preferred knowledge of semiconductor packaging processes and reliability.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication skills.
- Ability to work in a fast-paced and changing environment.
- Initiative and drive for results in team settings.
