Packaging Engineering Intern MS/PhD
Location
Dallas, TX
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-11-19
Responsibilities
- Assist in the design and development of semiconductor packaging technologies.
- Participate in cross-functional teams to develop internal and external solutions.
- Work on Wirebond, Flip Chip, Modules, SIPs, and other advanced packaging.
- Conduct mechanical, thermal, and electrical characterization of materials.
- Collaborate effectively with team members from different functions.
- Manage time effectively to ensure on-time project delivery.
- Drive initiatives and results in a fast-paced environment.
Job Requirements
- Currently pursuing a Masters degree in relevant engineering fields.
- Minimum cumulative GPA of 3.0/4.0.
- Knowledge of semiconductor packaging processes and reliability preferred.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication skills.
- Ability to work collaboratively in teams.
- Strong time management and initiative.
