Packaging Engineering Intern - MS/PhD - Santa Clara
Location
Santa Clara, CA
Level
Internship
Department
Semiconductors
Type
Salary
$95,000 - $120,000
Job Description
Posted on:
2025-10-10
Responsibilities
- Interface across various work areas and organizations for semiconductor packaging technologies.
- Participate in cross-functional teams to develop solutions for packaging technologies.
- Work on advancements in material, mechanical, thermal, and electrical characterization.
- Assist in the development of Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
- Collaborate effectively with team members from different functions.
- Demonstrate analytical and problem-solving skills.
- Manage time effectively to ensure on-time project delivery.
Job Requirements
- Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Cumulative GPA of 3.0/4.0 or higher.
- Knowledge of semiconductor packaging processes and reliability is preferred.
- Strong written and verbal communication skills.
- Ability to work in teams and collaborate effectively.
- Strong time management skills.
- Initiative and drive for results in a fast-paced environment.
