Packaging Engineering Intern - MS/PhD - Santa Clara
Location
Santa Clara, CA
Level
Internship
Department
Semiconductors
Type
Salary
$95,000 - $120,000
Job Description
Posted on:
2025-11-22
Responsibilities
- Collaborate with cross-functional teams on semiconductor packaging technologies.
- Participate in the development of internal and external solutions for packaging.
- Conduct mechanical, thermal, and electrical characterization of packaging advancements.
- Support the design and analysis of Wirebond, Flip Chip, and other advanced packages.
- Engage in problem-solving and analytical tasks related to semiconductor packaging.
- Communicate effectively with team members and stakeholders.
- Manage time effectively to ensure timely project delivery.
Job Requirements
- Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Minimum GPA of 3.0/4.0.
- Preferred knowledge in semiconductor packaging processes and reliability.
- Strong analytical and problem-solving skills.
- Effective written and verbal communication skills.
- Ability to work collaboratively in teams.
- Strong time management skills for project delivery.
