Packaging Engineering Intern - MS/PhD - Santa Clara
Location
Santa Clara, CA
Level
Internship
Department
Semiconductors
Type
Salary
$95,000 - $120,000
Job Description
Posted on:
2025-09-19
Responsibilities
- Participate in cross-functional teams for semiconductor packaging technology development.
- Work on various packaging technologies including Wirebond, Flip Chip, and Modules.
- Conduct mechanical, thermal, and electrical characterization of packaging advancements.
- Collaborate with team members across different functions.
- Analyze processes, assembly, reliability, and materials related to semiconductor packaging.
- Manage time effectively to ensure on-time project delivery.
- Build strong, influential relationships within the team.
Job Requirements
- Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Cumulative GPA of 3.0/4.0 or higher.
- Knowledge of semiconductor packaging processes and materials preferred.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication skills.
- Ability to work effectively in a fast-paced environment.
- Initiative and drive for results.
