Package Design Engineer
Location
Tempe, AZ
Level
Entry-Level
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-05-29
Responsibilities
- Design and develop hermetic/ceramic/metal and RAD tolerant/class P plastic packages.
- Manage tooling and qualification for packaging applications.
- Select and qualify materials and processes for packaging.
- Collaborate with product designers to create detailed package drawings using AutoCAD.
- Optimize processes in collaboration with assembly subcontractors.
- Qualify new packages and processes within project timelines.
- Maintain technical expertise on packaging advancements and innovations.
Job Requirements
- Bachelor’s or Master’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
- 0-2 years of relevant experience in package development.
- Understanding of semiconductor assembly processes and materials.
- Proficiency in AutoCAD, Excel, PowerPoint, and Word.
- Knowledge of wire-bonding, flip chip, and statistical process control is a plus.
- Strong interpersonal, communication, analytical, and presentation skills.
- Ability to work effectively in a team environment.
