Qualcomm

Thermal Engineer

Job Description

Posted on: 
2025-09-02

Responsibilities

  • Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.
  • Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.
  • Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.
  • Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.
  • Research thermal management materials and solutions for advanced electronics.
  • Develop and maintain documentation, guidelines, and tools to support design processes and project success.
  • Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Job Requirements

  • Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
  • 5+ years of hands-on experience in thermal modeling within the high-tech industry.
  • Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.
  • Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
  • Understanding of electronics cooling technologies (passive and active).
  • Knowledge of packaging technologies, server design, and thermal management materials.
  • Proven ability to work independently and collaboratively within a cross-functional team environment.
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