Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-09-03

Responsibilities

  • Design and simulate mechanical and thermal systems.
  • Test mechanical systems to ensure they meet design specifications.
  • Collaborate with a team of engineers on various projects.
  • Contribute to IC packaging and chip/package co-design efforts.
  • Engage in thermal modeling and signal integrity analysis.
  • Work on next-generation cooling solutions for semiconductor technologies.
  • Participate in professional development workshops and networking events.

Job Requirements

  • Currently enrolled in a mechanical engineering or related degree program.
  • Availability for 11-14 weeks during Summer 2026.
  • 1+ years of academic experience with programming languages like Python and Matlab.
  • Familiarity with CAD tools like AutoCAD and Solidworks.
  • Coursework in Solid Mechanics and Finite Element Analysis.
  • Knowledge of IC packaging structures and thermal system design.
  • Experience with Computational Fluid Dynamics (CFD) or related testing methodologies.
Apply now

More job openings