NVIDIA

Senior Program Manager, Chip Assembly Manufacturing Operations

Job Description

Posted on: 
2025-05-23

Responsibilities

  • Manage BOM supply chain and optimize sourcing solutions for best capacity and cost
  • Bring new products and technologies to high volume manufacturing
  • Deliver datamation solutions for enhanced decision making
  • Manage supplier performance evaluation matrix and keep it updated
  • Drive continuous improvement in manufacturing yield, cycle time, and product quality/reliability
  • Lead change control through qualification and notification
  • Lead non-conforming material disposition and problem solving

Job Requirements

  • Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, or Chemical Engineering
  • 12+ years of validated experience in Flip Chip semiconductor packaging design and process
  • Solid technical knowledge of materials, process, package design, and equipment technologies
  • Strong skills in project management and supplier management
  • Good understanding of quality control and statistics process control
  • Good knowledge of packaging industry and its supply chain
  • Excellent communication skills and experience working with multi-functional teams
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