Thermal Engineer

The Thermal Engineer will focus on thermal analysis and semiconductor packaging technologies to develop innovative thermal solutions for AI architectures in data centers, contributing to advanced packaging and system designs.

• Perform thermal simulations to influence package and system design.
• Propose novel thermal solutions for the product portfolio.
• Develop and validate thermal models for various packaging designs.
• Collaborate with design engineers to optimize thermal management solutions.
• Drive characterization and validation of thermal designs and electronic assemblies.
• Summarize and communicate findings to stakeholders.
• Develop automation scripts to enhance modeling efficiency.

• M.S. or Ph.D. in Mechanical Engineering or related field.
• 3-4 years of experience in package or system thermal analysis.
• Deep knowledge of thermal conduction and convective heat transfer.
• Experience with advanced thermal management technologies.
• Proficiency in using ANSYS Icepak, ANSYS Fluent, or Flotherm.
• Experience with lab-scale validation techniques.
• Excellent communication skills and ability to work in teams.