Lead Electronics Engineer

Augmental is an MIT Media Lab spinoff dedicated to redefining human-computer interaction. We're pioneering the development of intraoral wearable devices designed to revolutionize computer control and health monitoring. Our team of ambitious scientists, engineers, and designers are on a mission to create technology that not only enhances human capability and longevity, but also levels the playing field for those living with disabilities. We invite you to join us in developing the future of intraoral devices and hands-free computing!

As the Lead Electronics Engineer, you'll play an instrumental role in the prototyping and DFM phase of our flagship product. In this dynamic and multidisciplinary environment, you'll be in charge of electrical design, assembly, and evaluation of the electronic systems integral to our product.

You will push the boundaries of bio-interface manufacturing methods as you optimize electronic designs for in-mouth biosensing and peripherals, research and integrate novel sensors, construct test workflows for prototype validation, and implement groundbreaking hardware solutions. charge of electrical design, production, assembly, and evaluation of the electronic systems for the product.

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• Full responsibility for the electrical design, analysis, and assembly of our innovative intraoral wearable device.
• Drive IC selection, design for manufacturing (DFM), design for assembly (DFA), and electronics design for new products, peripherals, and accessories from concept to launch.
• Construct test setups to explore and deliver experimental hardware ideas through the design of experiments (DOE), integration strategies, and systems-level success criteria validation.
• Collaborate closely with software engineers, material scientists, and business professionals to accelerate the development and market readiness of our novel technology.

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• Experience in R&D related to wearable devices, implants, biotechnology, biomedical devices, mobile devices, or consumer electronics.
• Understanding of Flexible Printed Circuit (FPC) design and its manufacturing considerations.
• Proficiency in firmware development for embedded systems (C/C++) and data analysis (Python).
• Familiarity with ME CAD tools such as Fusion 360 and Solidworks, and FEM/FDTD simulation tools. Experience with antenna designs/testing is a plus.
• Knowledge of chemical sensing and experience with encapsulation materials and techniques, including Parylene C and chemical vapor deposition.
• Basic understanding of human physiology.

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