

VP, Advanced Packaging Technology
Location
Fremont, CA
Level
VP / Executive
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-07-25
Responsibilities
- Establish and implement a comprehensive technology roadmap for advanced packaging solutions.
- Work closely with product teams to guide the development of advanced packaging solutions.
- Ensure products meet performance, reliability, and cost targets.
- Engage with customers to understand their technology roadmaps and challenges.
- Oversee strategic partnerships and ecosystem engagements.
- Represent the company at industry events and panels.
- Influence customers' roadmaps and oversee co-development efforts.
Job Requirements
- Leadership experience in the Semiconductor industry with a focus on advanced packaging technologies.
- Proven success in fab/equipment company leadership within the packaging domain.
- Expertise in hybrid bonding and its impact on fab operations and equipment innovation.
- Proven track record of leading development and commercialization of advanced packaging solutions.
- Extensive ecosystem influence and participation in industry consortia.
- Recognized as an industry thought leader with experience presenting at major conferences.
- Willingness to travel significantly for customer engagements and partnerships.