

Head of Packaging Development Engineering, Silicon
Location
Mountain View, CA
Level
Manager / Director
Department
Consumer Electronics
Type
Salary
$227,000 - $320,000
Job Description
Posted on:
2025-05-26
Responsibilities
- Plan and develop packaging technology efforts with foundry and OSAT suppliers.
- Lead packaging design for optimal mobile silicon power and performance.
- Manage Signal Integrity and Power Integrity for the product Power Delivery Network (PDN).
- Ensure high-speed interfaces meet performance goals and provide hardware design guidance to system and ATE teams.
- Collaborate with commercial and product engineering teams on vendor management.
- Work with the Pixel team to meet thermal, electrical, and mechanical requirements.
- Drive technical projects from concept to volume production.
Job Requirements
- Bachelor's degree in relevant engineering fields or equivalent experience.
- 15 years of experience in packaging development.
- 8 years of experience in people management.
- Experience with packaging and substrate technologies.
- Knowledge of SoC physical design and system-level interactions.
- Ability to navigate organizational dynamics and lead cross-functional teams.
- Preferred: Master's degree or PhD in relevant engineering fields.