Google

Head of Packaging Development Engineering, Silicon

Job Description

Posted on: 
2025-05-26

Responsibilities

  • Plan and develop packaging technology efforts with foundry and OSAT suppliers.
  • Lead packaging design for optimal mobile silicon power and performance.
  • Manage Signal Integrity and Power Integrity for the product Power Delivery Network (PDN).
  • Ensure high-speed interfaces meet performance goals and provide hardware design guidance to system and ATE teams.
  • Collaborate with commercial and product engineering teams on vendor management.
  • Work with the Pixel team to meet thermal, electrical, and mechanical requirements.
  • Drive technical projects from concept to volume production.

Job Requirements

  • Bachelor's degree in relevant engineering fields or equivalent experience.
  • 15 years of experience in packaging development.
  • 8 years of experience in people management.
  • Experience with packaging and substrate technologies.
  • Knowledge of SoC physical design and system-level interactions.
  • Ability to navigate organizational dynamics and lead cross-functional teams.
  • Preferred: Master's degree or PhD in relevant engineering fields.
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