Packaging Engineering Intern
Location
Dallas, TX
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-09-27
Responsibilities
- Participate in the design and analysis of semiconductor packaging technologies.
- Collaborate with cross-functional teams to develop solutions for packaging technologies.
- Work on advancements in material, mechanical, thermal, and electrical characterization.
- Assist in the development of Wirebond, Flip Chip, Modules, SIPs, and other packaging types.
- Support projects aimed at miniaturization, integration, and high reliability.
- Engage in problem-solving and analytical tasks related to packaging processes.
- Maintain effective communication and collaboration with team members.
Job Requirements
- Currently pursuing a Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Minimum cumulative GPA of 3.0/4.0.
- Knowledge of semiconductor packaging processes and materials is preferred.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication abilities.
- Capability to work in teams and manage time effectively.
- Initiative and drive for results in a fast-paced environment.
