Packaging Engineering Intern
Location
Dallas, TX
Level
Internship
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-09-05
Responsibilities
- Collaborate with teams on semiconductor packaging technology development.
- Participate in the analysis of Wirebond, Flip Chip, and other advanced packaging methods.
- Conduct mechanical, thermal, and electrical characterization of packaging materials.
- Support the advancement of packaging technologies for miniaturization and performance.
- Engage in problem-solving and analytical tasks related to packaging processes.
- Communicate effectively with team members across different functions.
- Manage time effectively to ensure timely project delivery.
Job Requirements
- Currently pursuing a Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
- Minimum GPA of 3.0/4.0.
- Preferred knowledge in semiconductor packaging processes and materials.
- Strong analytical and problem-solving skills.
- Effective written and verbal communication abilities.
- Ability to work collaboratively in a team environment.
- Time management skills to meet project deadlines.
