Package Design Engineer
Location
Tempe, AZ
Level
Full-Time
Department
Consumer Electronics
Type
Salary
Job Description
Posted on:
2025-04-04
Responsibilities
- Design and develop packaging solutions for hermetic and plastic packages.
- Conduct tooling and qualification for packaging technologies.
- Benchmark and qualify materials, processes, and assembly subcontractors.
- Collaborate with product designers to create detailed package drawings using AutoCAD.
- Optimize processes through Design of Experiments (DOE) with OSAT/Palm Bay.
- Qualify new packages and processes in coordination with product groups and reliability teams.
- Maintain technical expertise on advancements in packaging technologies.
Job Requirements
- Master's/Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
- 0-2 years of relevant experience in package development.
- Understanding of semiconductor assembly processes and technologies.
- Proficient in AutoCAD, Excel, PowerPoint, and Word.
- Knowledge of wire-bonding, flip chip, and statistical process control.
- Strong interpersonal, analytical, and presentation skills.
- Ability to work in a flexible and inclusive environment.
