Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-11-30

Responsibilities

  • Design and test mechanical and thermal systems for semiconductor technologies.
  • Work collaboratively with a team of engineers.
  • Engage in projects related to IC packaging and chip/package co-design.
  • Conduct thermal modeling and signal integrity analysis.
  • Develop next-generation cooling solutions.
  • Utilize programming languages such as Python and Matlab.
  • Participate in professional development workshops and networking events.

Job Requirements

  • Currently enrolled in a degree program in mechanical engineering or related field.
  • Availability for 11–14 weeks during Summer 2026.
  • Expected graduation date of November 2026 or later.
  • Academic experience with programming languages.
  • Familiarity with design software such as AutoCAD and Solidworks.
  • Coursework in Solid Mechanics and Finite Element Analysis.
  • Knowledge of thermal system design and IC packaging processes.
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