Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2026-02-03

Responsibilities

  • Design and simulate mechanical systems for semiconductor technologies.
  • Test and validate thermal systems and solutions.
  • Collaborate with a team of engineers on various projects.
  • Work on IC packaging and chip/package co-design.
  • Engage in thermal modeling and signal integrity analysis.
  • Contribute to next-generation cooling solutions development.
  • Participate in professional development workshops and social events.

Job Requirements

  • Currently enrolled in a mechanical engineering or related degree program.
  • Availability for 11–14 weeks during Summer 2026.
  • 1+ years of academic experience with programming languages (e.g., Python, Matlab).
  • Familiarity with design software (Cadence Sip, AutoCAD, Solidworks).
  • Coursework in Solid Mechanics and Mechanics of Materials.
  • Understanding of IC packaging and thermal system design.
  • Exposure to Computational Fluid Dynamics (CFD) and airflow testing.
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