Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-09-03

Responsibilities

  • Design and simulate mechanical and thermal systems.
  • Test mechanical systems to ensure performance and reliability.
  • Collaborate with a team of engineers on various projects.
  • Work on IC packaging and chip/package co-design.
  • Conduct thermal modeling and signal integrity assessments.
  • Develop next-generation cooling solutions.
  • Gain hands-on experience in a professional engineering environment.

Job Requirements

  • Currently enrolled in a mechanical engineering or related degree program.
  • Availability for 11–14 weeks during Summer 2026.
  • Expected graduation date of November 2026 or later.
  • 1+ years of academic experience with programming languages (e.g., Python, Matlab).
  • Familiarity with CAD software (e.g., AutoCAD, Solidworks).
  • Knowledge of solid mechanics, thermal systems, and IC packaging.
  • Experience with Computational Fluid Dynamics (CFD) and thermal system design.
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