Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-10-18

Responsibilities

  • Design and simulate mechanical and thermal systems.
  • Test mechanical systems that support semiconductor technologies.
  • Contribute to projects related to IC packaging and chip/package co-design.
  • Engage in thermal modeling and signal/power integrity analysis.
  • Develop next-generation cooling solutions.
  • Collaborate with a team of engineers on engineering projects.
  • Participate in professional development workshops and events.

Job Requirements

  • Currently enrolled in a mechanical engineering or related degree program.
  • Availability for 11-14 weeks during Summer 2026.
  • 1+ years of academic experience with programming languages (Python, Matlab).
  • Familiarity with design software (Cadence Sip, AutoCAD, Solidworks).
  • Coursework in Solid Mechanics and Finite Element Analysis (FEA).
  • Knowledge of IC packaging and thermal system design.
  • Exposure to Computational Fluid Dynamics (CFD) and airflow measurements.
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