Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2025-11-08

Responsibilities

  • Design and simulate mechanical and thermal systems.
  • Test mechanical systems supporting semiconductor technologies.
  • Work on IC packaging and chip/package co-design.
  • Engage in thermal modeling and signal/power integrity projects.
  • Collaborate with a team of engineers on various projects.
  • Contribute to next-generation cooling solutions.
  • Participate in professional development workshops and networking events.

Job Requirements

  • Currently enrolled in a mechanical engineering or related degree program.
  • Available for 11–14 weeks during Summer 2026.
  • 1+ years of academic experience with programming languages like Python and Matlab.
  • Familiarity with CAD tools such as AutoCAD and Solidworks.
  • Coursework in Solid Mechanics and Finite Element Analysis (FEA).
  • Knowledge of IC packaging structures and electronic packaging processes.
  • Experience with thermal system design and modeling.
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