Qualcomm

Mechanical Engineering Internship – Summer 2026

Job Description

Posted on: 
2026-01-13

Responsibilities

  • Design, simulate, and test mechanical and thermal systems.
  • Collaborate with a team of engineers on IC packaging and chip/package co-design.
  • Engage in thermal modeling and signal/power integrity projects.
  • Contribute to the development of next-generation cooling solutions.
  • Utilize programming languages such as Python and Matlab.
  • Participate in professional development workshops and social events.
  • Work closely with a mentor and receive support from management.

Job Requirements

  • Currently enrolled in a bachelor's, master's, or Ph.D. program in mechanical engineering or related field.
  • Availability for 11–14 weeks during Summer 2026.
  • 1+ years of academic experience with programming languages.
  • Familiarity with CAD tools like AutoCAD and Solidworks.
  • Coursework in Solid Mechanics and Finite Element Analysis.
  • Knowledge of IC packaging structures and electronic packaging processes.
  • Experience with thermal system design and modeling.
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