Analog Devices

Packaging Engineer

Job Description

Posted on: 
2025-04-10

Responsibilities

  • Communicate with Business Units to understand package requirements and influence design decisions.
  • Collaborate with overseas assembly subcontractors for new package development.
  • Work with cross-functional teams including reliability and supply chain management for engineering support.
  • Manage projects to ensure on-time delivery of development projects.
  • Select package bill of materials (BOM) based on mechanical, thermal, and electrical properties.
  • Create package models and drawings using CAD tools for development and documentation.
  • Develop manufacturing processes and conduct finite element analysis as needed.

Job Requirements

  • Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics, or Electrical Engineering.
  • 1-5 years of industrial experience in related fields; a Master’s degree is preferred.
  • Knowledge of packaging technology, process flow, and manufacturing implementation.
  • Familiarity with IC package reliability requirements and failure analysis techniques.
  • Understanding of assembly process issues and statistical process control.
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