Analog Devices

Mechanical Engineering

Job Description

Posted on: 
2025-09-26

Responsibilities

  • Design mechanical packaging solutions for multi-chip assemblies using chip-and-wire and SMT technologies.
  • Create detailed housing assemblies for integrated mixed-technology systems.
  • Conduct static and transient thermal analysis for systems.
  • Perform structural analysis to ensure reliability under various environmental conditions.
  • Oversee design and fabrication documentation preparation.
  • Prepare design review documentation and participate in design reviews.
  • Conduct proposal research and prepare cost and schedule estimates.

Job Requirements

  • Bachelor’s degree in mechanical engineering; Master’s preferred.
  • Previous intern experience or exposure to RF and microwave electronics is a plus.
  • Strong organizational and planning skills, with a desire for growth.
  • Proficiency in solid modeling and FEA analysis tools like ANSYS.
  • Ability to obtain U.S. government security clearance.
  • U.S. citizenship or permanent residency required.
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