Director, Advanced Packaging Technology Development and Execution
Location
Austin, TX
Level
VP / Executive
Department
Semiconductors
Type
Salary
Job Description
Posted on:
2025-06-07
Responsibilities
- Define and drive AMD’s advanced packaging technology roadmap.
- Lead cross-functional packaging development programs.
- Translate system-level requirements into packaging specifications.
- Evaluate and select advanced packaging technologies.
- Partner closely with foundries and OSATs for manufacturing readiness.
- Drive yield, reliability, cost, and manufacturability considerations.
- Monitor execution milestones and escalate risks with mitigation plans.
Job Requirements
- 15+ years of experience in semiconductor packaging development.
- Proven leadership in defining and executing packaging roadmaps.
- In-depth knowledge of advanced packaging technologies.
- Hands-on experience with OSATs and substrate suppliers.
- Familiarity with package design tools and simulation requirements.
- Strong communication and leadership skills.
- Academic credentials in Materials Science, Mechanical Engineering, Electrical Engineering, or related discipline.
